Self-repairing cyclic oxide-substituted chitosan polyurethane networks

ABSTRACT

Thermosetting polymeric compositions, such as polyurethane compositions, and related methods are provided. The invention relates to coating and polymer compositions and related methods derived from a biodegradable natural polysaccharide compound such as chitosan, pectin, heparin, and combinations thereof reacted to a cyclic oxide compound, such as an oxetane, oxolane or oxepane compound. The compositions and methods of the present invention exhibit self-repairing properties upon exposure to ultraviolet (UV) light. The compositions and methods of the present invention can be used in many coating applications, such as the transportation, packaging, fashion, and biomedical industries.

CROSS-REFERENCES TO RELATED APPLICATIONS

This application is a divisional application of U.S. patent applicationSer. No. 12/722,994, filed on Mar. 12, 2010 and now U.S. Pat. No.______, which claims benefit of priority to U.S. Provisional ApplicationSer. No. 61/170,861, filed Apr. 20, 2009, which are hereby incorporatedby reference herein in their entirety.

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

This invention was made with government support under National ScienceFoundation (NSF) Cooperative Agreement #DMR-0213883. The government mayhave certain rights in this invention.

FIELD OF THE INVENTION

The invention relates to coating and polymer compositions and relatedmethods derived from a reaction product of a biodegradable naturalpolysaccharide, such as chitosan and a cyclic oxide, such as oxetane,oxolane or oxepane compound. More specifically, the invention relates tocoating and polymer compositions and related methods that allow thecoating compositions to self-repair damage by exposure to an ultraviolet(UV) source.

BACKGROUND OF THE INVENTION

Thermosetting polymers, such as polyurethanes, have many properties thatqualify them as high performance polymeric materials, but there arestill a few shortfalls. For example, polyurethanes still suffer frommechanical damage, such as when a hard or sharp object hits vehicle, itis likely that it will leave a scratch. To try to combat these types ofmechanical damage to coatings, the automotive industry looks forcoatings with high scratch resistance. Due to their hardness andelasticity polyurethanes exhibit good scratch resistance, but can stillsuffer from mechanical damage.

Mechanical damage occurs in all types of substrates. For example, toheal mechanical damages in plants, suberin, tannins, phenols, or nitricoxide are activated to prevent further lesions, whereas in a human skinouter flow of blood cells are arrested by the crosslink network offibrin, giving rise to wound-healing. Concentration gradients orstratification in living organisms inspired the development of spatiallyheterogeneous remendable polymers, composites containingmicro-encapsulated spheres, encapsulated fibers, reversiblecross-linking, and microvascular networks.

Attempts have been made by others to repair mechanical damage to varioussubstrates. One such example includes epoxy matrices containing a glasshollow fiber filled with a monomer and an initiator with the ‘bleeding’ability to heal polymer networks during crack formation. Similarphenomenon was utilized in another approach, where a micro-encapsulateddicyclopentadiene monomer was introduced in a catalyst embedded polymermatrix, which healed the crack by the ring opening of the monomer.Reversibility of Diels-Alder reactions resulted in another attractiveapproach to thermally repair damaged areas which utilized malemide-furanadducts. Mimicking of microvascular structures, water-responsiveexpandable gels, and formation of supramolecular assemblies are otheravenues of remendability.

While progress has been made in attempts to repair damage to varioustypes of systems, coatings still lack the ability to repair mechanicaldamage to which they are exposed. A need exists for polymer systems thatare capable of self-repairing mechanical damage to which they areexposed. It would be advantageous for the polymers to be useful incoatings, so that the coating could be able to mend itself. It would befurther advantageous if the repair could occur when the coating issimply exposed to ambient conditions, such as UV exposure from the sun.

SUMMARY OF THE INVENTION

In view of the foregoing, thermosetting polymeric compositions andrelated methods are provided as embodiments of the present invention.Methods of making the compositions are provided. Methods of using thecompositions are also provided. The thermosetting polymeric compositionsand related methods enable substrates upon which the compositions areapplied to self-repair mechanical damage upon exposure to ultraviolet(UV) sources, such as the sun.

For example, as an embodiment of the present invention, anoxetane-substituted chitosan polyurethane composition is provided.Oxetane generally refers to 1,3-propylene oxide. In this embodiment, thecyclic oxide-substituted chitosan polyurethane composition comprises:

wherein HDI=an isocyanate, CHI=a chitosan compound, OXE=an oxetane,oxolane or oxepane compound, m=a number of moles of HDI used to producethe composition; p=a number of moles of a polyol used to produce thecomposition, and n=a number of moles of the chitosan compound used toproduce the composition. In an aspect, m ranges from 3-450, p rangesfrom 0-540; and n ranges from 5-650.

As another embodiment of the present invention, an cyclicoxide-substituted chitosan composition is provided. In this embodiment,the cyclic oxide-substituted chitosan composition comprises:

[CHI-OXE₁₋₂]_(n)

wherein OXE=oxetane, oxolane or oxepane, and n=a number of moles of achitosan compound used to produce the composition. In an aspect, nranges from 5-650. In an aspect, the OXE-substituted chitosancomposition comprises:

wherein n=a number of moles of the chitosan compound used to produce thecomposition. In an aspect, n ranges from 5-650. In this example, theoxetane is 3,3 dimethyloxetane.

Besides using chitosan, other biodegradable natural polysaccharides,such as pectin and heparin or combinations thereof. In an aspect, as anembodiment of the present invention, an oxetane-substitutedbiodegradable natural polysaccharide composition is provided. Thecomposition comprises:

[BNP-OXE₁₋₂]_(n)

wherein BNP=a biodegradable natural polysaccharide compound selectedfrom the group consisting of chitosan, pectin, heparin, and combinationsthereof, OXE=an oxetane, oxolane or oxepane compound, and n=5-650. Othersuitable types of biodegradable natural polysaccharide compounds thatcan be used in embodiments of the present invention will be apparent tothose of skill in the art and are to be considered within the scope ofthe present invention.

Besides using oxetane, other substituted-cyclic oxide compounds can beused in embodiments of the present invention. For example, 1,6-hexyleneoxide (i.e., oxepane) or 1,4-butylene oxide (i.e., oxolane ortetrahydrofuran) can be used. Other suitable types of substituted-ringcompounds that can be used in embodiments of the present invention willbe apparent to those of skill in the art and are to be considered withinthe scope of the present invention.

TABLE 1 Commercial Chemical Name IUPAC Name Structure Four Member1,3-propylene oxide Oxetane Oxetane

Five Member 1,4-butylene oxide Oxolane Tetrahydrofuran

Seven Member 1,6-hexylene oxide Oxepane

Besides the compositions, methods of making the compositions are alsoprovided. For example, a method of producing a polyurethane compositioncapable of self-repairing mechanical damage to a substrate on which thecomposition has been applied is provided as an embodiment of the presentinvention. In this method of producing the polyurethane composition, achitosan compound is contacted with a cyclic oxide such as an oxetane,oxolane or oxepane compound to produce a precursor product comprising:

[CHI-OXE₁₋₂]_(n)

wherein OXE=oxetane, oxolane or oxepane, and n=a number of moles of achitosan compound used to produce the composition. In an aspect, nranges from 5-650. The precursor product is then contacted with anisocyanate and a polyol to produce the polyurethane compositioncomprising:

wherein HDI=an isocyanate, CHI=a chitosan compound, OXE=oxetane, oxolaneor oxepane m=a number of moles of HDI used to produce the composition;p=a number of moles of a polyol used to produce the composition, and n=anumber of moles of the chitosan compound used to produce thecomposition. In an aspect, m ranges from 3-450, p ranges from 0-540; andn ranges from 5-650. Representative OXE reactants include 3-ethyl-3-phenoxymethyloxetane, 3-ethyl-3-allyloxymethyloxetane,3-methyl-3-phenoxymethyloxetane,3-ethyl-3-[(2-ethylhexyloxy)methyl]oxetane,bis{[(1-ethyl(3-oxetanyl)]methyl}ether,1,4-bis[(3-ethyl-3-oxetanylmethoxy)methyl]benzene, bis[(3-ethyl-3-oxetanylmethoxy)methyl]terephthalate,bis[(3-ethyl-3-oxetanylmethoxy)methyl]phenyl ether, 2-phenyloxetane, 3,3bischloromethyloxetane, 3,3-dimethyloxetane and3,3-bisbromomethyloxetane. Similarly substituted oxepane and oxolanecompounds can also be used.

As another method embodiment of the present invention, a method ofrepairing mechanical damage to a substrate is provided. In thisembodiment, a cyclic oxide-substituted chitosan polyurethane compositionis applied to a substrate. One such oxetane-substituted chitosanpolyurethane composition comprises:

wherein PEG=a polyol or a thiol, m=a number of moles of an isocyanateused to produce the composition; p=a number of moles of the polyol usedto produce the composition, and n=a number of moles of a chitosancompound used to produce the composition. In an aspect, m ranges from3-450, p ranges from 0-540; and n ranges from 5-650. Once thecomposition is applied to the substrate, the substrate is exposed to aUV source to initiate self-repair of the mechanical damage to thesubstrate. The compositions described herein prophylactically repairmechanical damage to a substrate upon application of the compositionsdescribed herein. Upon exposure of the substrate to a UV source, thecomposition initiates self-repair of the mechanical damage to thesubstrate.

BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a schematic illustrating the synthesis steps involved in theformation of OXE-CHI illustrating the reactions of oxetane with CHIleading to the formation of OXE-CHI precursor and the reactions ofOXE-CHI with HDI and PEG leading to formations of remendable OXE-CHI-PURnetwork in accordance with embodiments of the present invention;

FIG. 2 represents IR (upper) images and optical (lower) images ofOXE-CHI-PUR networks (wherein OXE is oxetane) recorded as a UV exposuretime, with A1 representing 0 min; A2 representing 15 min; and A3representing 30 min in accordance with embodiments of the presentinvention;

FIG. 3 represents optical images of mechanically damaged films of: PUR(A1, A2, and A3 are images after exposure for 0, 15 and 30 min to UVradiation; HDI/PEG/CHI=1:1.5:0); CHI-PUR (B1, B2, and B3 are imagesafter exposure for 0, 15 and 30 min to UV radiation;HDI/PEG/CHI=1:1.4:0.57×10⁻⁴); OXE-CHI-PUR (C1, C2, and C3 are imagesafter exposure for 0, 15 and 30 min to UV radiation;HDI/PEG/OXE-CHI=1:1.4:0.57×10⁻⁴); OXE-CHI-PUR (D1, D2 and D3 are imagesafter exposure for 0, 15 and 30 min to UV radiation;HDI/PEG/OXE-CHI=1:1.33:1.17×10⁻⁴) made in accordance with embodiments(wherein OXE is oxetane) of the present invention;

FIG. 4 illustrates an ATR FT-IR spectra of (A) CHI and (B) OXE-CHIproducts made in accordance with embodiments (wherein OXE is oxetane) ofthe present invention;

FIG. 5 illustrates a Raman spectra of (A) CHI and (B) OXE-CHI productsmade in accordance with embodiments (wherein OXE is oxetane) of thepresent invention;

FIG. 6 illustrates a solid state ¹³C NMR spectra of (A) CHI and (B)OXE-CHI products in accordance with embodiments (wherein OXE is oxetane)of the present invention;

FIG. 7 illustrates a solid state ¹³C NMR spectra of PUR network inaccordance with embodiments of the present invention;

FIG. 8 illustrates a solid state ¹³C NMR spectra of OXE-CHI-PUR networkin accordance with embodiments (wherein OXE is oxetane) of the presentinvention;

FIG. 9 illustrates an ATR FT-IR spectra of (A) OXE-CHI products and (B)OXE-CHI-PUR networks in accordance with embodiments (wherein OXE isoxetane) of the present invention;

FIG. 10 illustrates an ATR FT-IR spectra of OXE-CHI-PUR networksrecorded before (Trace A) and after (Trace B) UV exposure for 30 min ofthe specimen shown in FIG. 3(A) in accordance with embodiments (whereinOXE is oxetane) of the present invention;

FIG. 11 illustrates internal reflection IR images (IRIRI) recorded frommechanically damaged and undamaged areas of polyurethane network: (A-C)images that were obtained by tuning into the 1542 cm⁻¹ band; (A1-A3,B1-B3, C1-C3) IR spectra recorded from mechanically damaged andundamaged areas of (A-C) images, respectively in accordance withembodiments (wherein OXE is oxetane) of the present invention;

FIG. 12 illustrates internal reflection IR images (IRIRI) recorded frommechanically damaged and undamaged areas of polyurethane network: (A-C)images obtained by tuning into the 1348 cm⁻¹ band; (A1-A3, B1-B3, C1-C3)IR spectra recorded from mechanically damaged and undamaged areas of(A-C) images, respectively in accordance with embodiments (wherein OXEis oxetane) of the present invention;

FIG. 13A is a graphical illustration showing mechanical damage of a film(A→B) followed by repair (B→C) and FIG. 13B shows possible chemicalreactions leading to repair of OXE-CHI-PUR networks in accordance withembodiments (wherein OXE is oxetane) of the present invention;

FIG. 14 shows the steps leading to the formation of OXE-CHI-PUR,OXO-CHI-PUR and OXE/OXO-CHI-PUR networks (wherein OXE is oxetane and OXOis oxolane); and

FIG. 15 shows the optical images of OXO-CHI-PUR network recorded as a UVexposure time A1) 0 min; A2) 15 min; A3) 30 min; A4) 60 min and ofOXE-OXO-CHI-PUR network B1) 0 min; B2) 15 min; B3) 30 min; B4) 60 min.

While the invention is susceptible to various modifications andalternative forms, specific embodiments have been shown by way ofexample in the drawings and will be described in detail herein. However,it should be understood that the invention is not intended to be limitedto the particular forms disclosed. Rather, the intention is to cover allmodifications, equivalents and alternatives falling within the spiritand scope of the invention as defined by the appended claims.

DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

Illustrative embodiments of the invention are described below as theymight be employed in the reactions and compositions related tothermosetting polymers. In the interest of clarity, not all features ofan actual implementation are described in this specification. It will ofcourse be appreciated that in the development of any such actualembodiment, numerous implementation-specific decisions must be made toachieve the developers' specific goals, which will vary from oneimplementation to another. Moreover, it will be appreciated that such adevelopment effort might be complex and time-consuming, but wouldnevertheless be a routine undertaking for those of ordinary skill in theart having the benefit of this disclosure. Further aspects andadvantages of the various embodiments of the invention will becomeapparent from consideration of the following description.

Thermosetting polymeric compositions, such as polyurethane compositions,and related methods are provided as embodiments of the presentinvention. Methods of making the compositions are provided, Methods ofusing the compositions are also provided.

More specifically, polyurethane networks are provided as embodiments ofthe present invention that exhibit self-repairing properties uponexposure to ultraviolet (UV) light. The polyurethane network includes acyclic oxide such as oxetane, oxolane or oxepane-substituted chitosanprecursor incorporated into a two-component polyurethane. Uponmechanical damage of the network, oxide rings (e.g. oxetane, oxolane oroxepane rings) open to create two reactive ends. When exposed to UVlight, chitosan chain scission occurs that forms crosslinks with thereactive oxide ends, thus repairing the network. The produced materialsare capable of repairing themselves in less than an hour and can be usedin many coatings applications ranging from transportation to packagingor fashion and biomedical industries. The methods and compositions madein accordance with embodiments of the present invention can also be usedin various other industries, as will be apparent to those of skill inthe art and are to be considered within the scope of the presentinvention.

In embodiments of the present invention, heterogeneous polyurethane(PUR) networks are produced based on cyclic oxide-substituted derivativeof chitosan (OXE-CHI) being reacted with hexamethylene diisocyanate(HDI) and polyethylene glycol (PEG) to form heterogeneous OXE-CHI-PURnetworks. Each of the components used to produce the polyurethanenetworks in the present invention possess specification properties thatserve specific functions. For example, PUR networks generally providedesirable heterogeneity through polyurethane and polyurea components andOXE-CHI provides the cleavage of a constrained 4, 5 or 7-membered ring(OXE) and UV sensitivity through CHI. Chitosan is generally a product ofdeacetylation of chitin, which is the structural element of exoskeletonsof crustaceans (crabs, shrimp, etc.) that occurs in abundance in nature.

For example, as an embodiment of the present invention, a cyclicoxide-substituted chitosan polyurethane (OXE-CHI-PUR) composition isprovided. In this embodiment, the oxetane-substituted chitosanpolyurethane composition comprises:

wherein HDI=an isocyanate, CHI=a chitosan compound, OXE=an oxetane,oxolane or oxepane compound, m=a number of moles of HDI used to producethe composition; p=a number of moles of a polyol used to produce thecomposition, and n=a number of moles of the chitosan compound used toproduce the composition. In an aspect, m ranges from 3-450, p rangesfrom 0-540; and n ranges from 5-650. Representative OXE reactantsinclude 3-ethyl-3-phenoxymethyloxetane, 3-ethyl-3-allyloxymethyloxetane, 3-methyl-3-phenoxymethyloxetane, 3-ethyl-3-[(2-ethylhexyloxy)methyl]oxetane, bis{[(1-ethyl(3-oxetanyl)]methyl}ether, 1,4-bis[(3-ethyl-3-oxetanylmethoxy)methyl]benzene, 3,3-dimethyl oxetane, bis[(3-ethyl-3-oxetanylmethoxy)methyl]terephthalate,bis[(3-ethyl-3-oxetanylmethoxy)methyl]phenyl ether, 2-phenyloxetane,3,3-bischloromethyloxetane, and 3,3-bisbromomethyloxetane. Similarlysubstituted oxepane and oxolane compounds can also be used.

The types of isocyanates used in embodiments of the present inventioncan be varied. For example, in an aspect, the isocyanate can includemethylenediisocyanate (MDI); hexamethylenediisocyanate (HDI);isophorenediisocyanate (IPDI); toluenediisocyanate (TDI); 2,4-toluenediisocyanate; 2,6-toluene diisocyanate; 2,2′-methylenediphenylenediisocyanate; 2,4′-methylenediphenylene diisocyanate;4,4′-methylenediphenylene diisocyanate; polyphenylene polymethylenepolyisocyanate; saturated 2,4-methylcyclohexane diisocyanate, saturated2,6-methylcyclohexane diisocyanate; 2,2′-methylene dicyclohexylenediisocyanate; 2,4′-methylene dicyclohexylene diisocyanate;4,4′-methylene dicyclohexylene diisocyanate; isophorone diisocyanate;1,4-diisocyanatobutane; 1,5-diisocyanatopentane; 1,6-diisocyanatohexane;1,4-cyclohexane diisocyanate; isomeric mixtures thereof; or combinationsthereof. Other suitable types of isocyanates will be apparent to thoseof skill in the art and are to be considered within the scope of thepresent invention.

Besides varying the types of isocyanates used in compositions andmethods described herein, the types of polyols used can also be varied.In an aspect, for example, the polyol can include ethylene glycol,diethylene glycol, triethylene glycol, tetraethylene glycol,polyethylene glycol, propylene glycol, dipropylene glycol, polypropyleneglycol, 1,4-butanediol, 1,6-hexanediol, polytetramethylene glycol,polyesterdiol, derivatives thereof, or combinations thereof, andmixtures thereof. Other suitable types of polyols will be apparent tothose of skill in the art and are to be considered within the scope ofthe present invention.

Similarly, in embodiments of the present invention that use thiols, thetypes of thiols used can be varied. For example, the thiol can includepolythiol, pentaerythritol tetrakis(3-mercaptoproprionate) (PET3MP),trifunctional thiols, tetrafunctional thiols, thiol esters, thiolacrylates, or combinations thereof. Other suitable types of thiols willbe apparent to those of skill in the art and are to be considered withinthe scope of the present invention.

In an aspect, the composition comprises a structure as follows:

wherein PEG=a polyol, m=a number of moles of an isocyanate used toproduce the composition; p=a number of moles of the polyol used toproduce the composition, and n=a number of moles of a chitosan compoundused to produce the composition. In an aspect, m ranges from 3-450, pranges from 0-540; and n ranges from 5-650.

The compositions described herein are useful in a variety ofapplication. For example, the compositions described herein can be usedin various types of coatings. The coatings can include the compositionsdescribed herein. In an aspect, the coatings can include the cyclicoxide-substituted chitosan polyurethane (OXE-CHI-PUR) composition havinga formula as follows:

wherein PEG=polyethylene glycol, m=a number of moles of an isocyanateused to produce the composition; p=a number of moles of the polyol usedto produce the composition, and n=a number of moles of a chitosancompound used to produce the composition. In an aspect, m ranges from3-450, p ranges from 0-540; and n ranges from 5-650.

As another embodiment of the present invention, an oxetane-substitutedchitosan composition is provided. In this embodiment, theoxetane-substituted chitosan (OXE-CHI) composition comprises:

[CHI-OXE₁₋₂]_(n)

wherein OXE=oxetane, oxolane or oxepane, and n=a number of moles of achitosan compound used to produce the composition. In an aspect, theoxetane-substituted chitosan composition comprises:

wherein n=a number of moles of the chitosan compound used to produce thecomposition. In an aspect, n ranges from 5-650.

Besides using chitosan, other biodegradable natural polysaccharides,such as pectin and heparin or combinations thereof. In an aspect, as anembodiment of the present invention, an oxetane-substitutedbiodegradable natural polysaccharide composition is provided. Thecomposition comprises:

[BNP-OXE₁₋₂]_(n)

wherein BNP=a biodegradable natural polysaccharide compound selectedfrom the group consisting of chitosan, pectin, heparin, and combinationsthereof, OXE=an oxetane, oxolane or oxepane compound, and n=5-650. In anaspect, oxetane-substituted biodegradable natural polysaccharidecomposition can be reacted with a polyol and an isocyanate to produce anoxetane-substituted biodegradable natural polysaccharide polyurethanecomposition. Other suitable types of biodegradable naturalpolysaccharide compounds that can be used in embodiments of the presentinvention will be apparent to those of skill in the art and are to beconsidered within the scope of the present invention.

Besides using oxetane, other substituted-ring compounds can be used inembodiments of the present invention. For example, 1,6-hexylene oxide(i.e., oxepane) or 1,4 butylene oxide (i.e., oxolane or tetrahydrofuran)can be used. Other suitable substituted-ring compounds that can be usedin embodiments of the present invention will be apparent to those ofskill in the art and are to be considered within the scope of thepresent invention.

Besides the compositions, methods of making the compositions are alsoprovided as embodiments of the present invention. For example, a methodof producing a polyurethane composition capable of self-repairingmechanical damage to a substrate on which the composition has beenapplied is provided as an embodiment of the present invention. In thismethod of producing the polyurethane composition, a chitosan compound iscontacted with an oxetane compound to produce a precursor productcomprising:

[CHI-OXE₁₋₂]_(n)

wherein OXE=oxetane, oxolane or oxepane, and n=a number of moles of achitosan compound used to produce the composition. In an aspect, nranges from 5-650. The precursor product is then contacted with anisocyanate and a polyol to produce the polyurethane compositioncomprising:

wherein HDI=an isocyanate, CHI=a chitosan compound, OXE=an oxetane,oxolane or oxepane compound, m=a number of moles of HDI used to producethe composition; p=a number of moles of a polyol used to produce thecomposition, and n=a number of moles of the chitosan compound used toproduce the composition. In an aspect, m ranges from 3-450, p rangesfrom 0-540; and n ranges from 5-650.

In an aspect of the methods described herein, when the chitosan compoundcontacts the oxetane compound, the step typically occurs in the presenceof a solvent. Any basic solvent that is compatible with the componentsused in the methods and compositions described herein can be used, aswill be understood by those of skill in the art. In an aspect, thesolvent can be sodium hydroxide, sodium carbonate, potassium hydroxide,or combinations thereof. Other suitable types of solvents that can beused in embodiments of the present invention will be apparent to thoseof skill in the art and are to be considered within the scope of thepresent invention.

As another method embodiment of the present invention, a method ofrepairing mechanical damage to a substrate is provided. In thisembodiment, a cyclic oxide-substituted chitosan polyurethane compositionis applied to a substrate. The oxetane-substituted chitosan polyurethanecomposition comprises:

wherein PEG=a polyol or a thiol, m=a number of moles of an isocyanateused to produce the composition; p=a number of moles of the polyol usedto produce the composition, and n=a number of moles of a chitosancompound used to produce the composition. In an aspect, m ranges from3-450, p ranges from 0-540; and n ranges from 5-650. Once thecomposition is applied to the substrate, the substrate is exposed to aUV source to initiate self-repair of the mechanical damage to thesubstrate. The compositions described herein prophylactically repairmechanical damage to a substrate upon application of the compositionsdescribed herein. Upon exposure of the substrate to a UV source, thecomposition initiates self-repair of the mechanical damage to thesubstrate.

In embodiments using chitosan, the chitosan can have a degree ofdeacetylation ranging from about 75% to about 85%. Chitosan have otherdegrees of deacetylation can be used, as will be understood by those ofskill in the art.

The oxetane compound can be supplied using various types of oxetanecompounds. For example, the oxetane compound can be a halide-substitutedoxetane compound comprising 3-(Chloromethyl)-3-methyloxetane,methyl-substituted oxetane, or combinations thereof. Other suitabletypes of oxetane compounds that can be used in the present inventionwill be apparent to those of skill in the art and are to be consideredwithin the scope of the present invention. Representative OXE reactantsinclude 3-ethyl-3-phenoxymethyl oxetane, 3-ethyl-3-allyloxymethyloxetane, 3-methyl-3-phenoxymethyloxetane,3-ethyl-3-[(2-ethylhexyloxy)methyl]oxetane,bis{[(1-ethyl(3-oxetanyl)]methyl}ether, 1,4-bis[(3-ethyl-3-oxetanylmethoxy)methyl]benzene, 3,3-dimethyloxetane,bis[(3-ethyl-3-oxetanylmethoxy)methyl]terephthalate,bis[(3-ethyl-3-oxetanylmethoxy)methyl]phenyl ether, 2-phenyloxetane,3,3-bischloromethyloxetane, and 3,3-bisbromomethyloxetane. Similarlysubstituted oxepane and oxolane compounds can also be used.

The compositions and methods described herein can be used in many typesof applications. The types of substrates on which the compositions canbe applied thereto can include metal, plastic, glass, or combinationsthereof. More specifically, the types of substrates on which thecompositions can be applied thereto can include motor crafts,automobiles, mechanical parts, weapons, military equipment, watercrafts,jewelry, electronics, or combinations thereof. The compositions andmethods described herein can be used in other applications, such as ondifferent substrates, as will be apparent to those of skill in the artand are to be considered within the scope of the present invention.

Turning to the Figures, FIG. 1 illustrates a two-step reaction sequenceleading to the OXE-CHI-PUR formation. In the first reaction step that isused for the synthesis of OXE-CHI, the primary alcohol of CHI is reactedwith chloromethyl of oxetane, OXE. An OXE ring is reacted to the C₆position of the chitosan molecule, which is confirmed by IR, Raman and¹³C-NMR spectroscopy as shown in FIGS. 4, 5, and 6, respectively.

The second reaction step illustrates the reactions leading to theincorporation of oxetane OXE-CHI into the tri-functional HDI in thepresence of PEG (1:1.4 and 1:1.33 molar ratios), which can be confirmedby IR and ¹³C-NMR spectroscopy as shown in FIGS. 7 and 8, respectively.

To demonstrate the self-healing properties of the compositions describedherein, networks were allowed to crosslink under ambient conditions toform solid films, which were then mechanically damaged by creating ascratch. FIG. 2, A1 illustrates a mechanical damage to oxetaneOXE-CHI-PUR films. When the damaged area is exposed to a 120 Wfluorescent UV lamp at 302 nm wavelength of light for 15 min. (FIG. 2,A2) and 30 min (FIG. 2, A3), the damaged area vanishes.

A series of controlled experiments were conducted on specimens preparedby varying the molar ratios of oxetane OXE-CHI with respect to the PURcontent, as shown in Table S1. Optical images shown in FIG. 3, A-D,illustrate the results of the experiments conducted under the same UVexposure conditions (at 0, 15, and 30 min) conducted on the specimenslisted in Table S1.

TABLE S1 Exposure Time (min) Molar Ratios of Individual 0 15 30 SpecimenComponents Damage Width (μm) + 0.1 A PUR 10 10 10 HDI:PEG:CHI = 1:1.5:0B CHI-PUR 20.5 20.5 20.5 MI:PEG:CHI = 1:1.4:0.57 × 10⁻⁴ C OXE-CHI-PUR2.26 1.08 0 HDI:PEG:OXE-CHI = 1:1.4:0.57 × 10⁻⁴ D OXE-CHI-PUR 6 5.2 0HDI:PEG:OXE-CHI = 1:1.33:1.17 × 10⁻⁴

The experiments illustrate that the presence of oxetane OXE-CHIcomponent is an important factor in the remendability of the network, asshown in FIGS. 2 and 3. As can be seen in Table S1, when using only PURor CHI-PUR (Specimens A and B in Table S1), neither of these specimensare able to repair the mechanical damage. In contrast, the presence ofthe covalently bonded OXE-CHI components (Specimens C and D in Table S1)facilitates the self-healing process. Table Si also shows the damagewidth as a function of UV exposure evaluations conducted on thespecimens shown in FIG. 3. Note that the rate of repair for networkscontaining half the OXE-CHI precursor concentration is also reduced.

While a cut is a local event at micrometer or smaller scales, the actualcleavage is a molecular level event. To determine the mechanism ofrepair and to follow molecular events in the damaged area, we utilizedlocalized micro-Attenuated Total Reflectance (μATR) FT-IR spectroscopyand internal reflection IR imaging (IRIRI). As shown in FIGS. 9 and 10,it is believed that the loss of urea and ether linkages of CHI (which iscircled in FIG. 1) containing OXE rings results from the UV lightexposure of damaged surface areas are responsible for repairing. Inthese experiments, the repair process utilizes UV light to recombinefree radicals to form crosslinks. In the 280-400 nm range, a fluorescentUV lamp generates approximately 0.3 W/m² per nm power density, whereasthe sun gives off about 0.25 W/m² per nm. Thus, the time frame forrepair based upon the sun exposure is very similar when compared tousing a fluorescent UV lamp, although the energy density changes as afunction of the wavelength of radiation for both sources vary somewhat.Due to stronger sun radiation during summer months in the southern U.S.the repair process will be approximately 3-4 times faster compared tothe equivalent exposure in the northern U.S., but for winter months thisdifference will be negligible. Since crosslinking reactions are notmoisture sensitive, dry or humid climate conditions will not affect therepair process. The above networks exhibit the ability to self-repairupon exposure to UV light, but if exactly the same previously repairedspot is damaged again, due to thermosetting characteristics of thesenetworks the ability for further repair may be limited.

As an advantage of the present invention, the use of the UV portion ofthe electromagnetic radiation from the sun for repairing mechanicaldamages in coatings offers an ambient temperature approach toself-healing, which is important in a number of applications andtechnologies that do not require the placement of other often elaboratenetwork components. As another advantage, the self-healing mechanismused in the present invention can be controlled by the chemistries andmorphologies of polymer networks produced.

EXAMPLES Example 1 Materials and Methods

Chitosan (CHI) with a degree of deacetylation ranging from about 75% toabout 85%, isopropyl alcohol, methanol, polyethylene glycol (PEG)(M_(w)=300), sodium hydroxide beads, acetone, dimethyl sulfoxide (DMSO),and dibutyltin dilaurate (DBTL) were purchased from Sigma Aldrich Co.3-(Chloromethyl)-3-methyloxetane and trifunctional homopolymer ofhexamethylene diisocyanate (HDI) (Desmodur XP 2410) were obtained fromTCI America and Bayer Materials Science.

2 grams of low molecular weight CHI (M_(n)˜5×10⁵) was added into a 150 g1(N) NaOH solution in a three-neck flask and stirred for 24 hrs at −5°C., followed by refrigeration at −18° C. for 48 hrs. The solution wasthawed and mixed with pre-cooled isopropyl alcohol and stirred for 1 hr.0.06 mole of pre-cooled 3-chloro-3-methyl oxetane was added to themixture, the temperature was raised to 80° C. and the solution wasstirred for 12 hr. The product was filtered and washed several timeswith methanol until it became neutral, followed by drying it at 60° C.for 12 hr and characterizing it by NMR and IR spectroscopy. Theresulting product was identified as oxetane-substituted chitosan(OXE-CHI).

The OXE-CHI product was dispersed in DMSO by sonicating at 25° C. for 12hrs followed by continuous stirring at 80° C. for 48 hrs. OXE-CHI-PURfilms were prepared by reacting trifunctional HDI with dispersed OXE-CHIand polyethylene glycol (PEG) using overhead agitation at 500 rpm with asmall four-blade polytetrafluoroethylene (PTFE) impeller in a 50 mlthree-neck reaction flask at 25° C. for 10 min under N₂ atmosphere. Aseries of PUR networks were prepared by adjusting the stoichiometricratios of NCO, OH, and NH₂ reactive groups. The following molar ratiosof HDI/PEG/CHI and HDI/PEG/OXE-CHI (where HDI/PEG forms PUR) wereutilized: HDI/PEG/CHI=1:1.5:0 and 1:1.4:0.57×10⁴;HDI/PEG/OXE-CHI=1:1.4:0.57×10⁴ and 1:1.33:1.17×10⁴, respectively, whilemaintaining 38% (w/w) solids. Such mixtures were applied to obtain anapprox. film thickness of 300 pm (±4 μm) on a PTFE substrate at 30° C.under 15% relative humidity (RH) for 12 hrs and in a vacuum oven at 80°C. for 48 hrs. The films were mechanically scratched with a razor bladeto obtain a desired width and depth of the scratch. Exposure to UVradiation was conducted using a 120 W fluorescent UV lamp of 302 nmwavelength of light.

Microscopic micro attenuated total reflectance Fourier transforminfrared (μATR FT-IR) were obtained using a Bio-Rad FTS-6000 FTIRsingle-beam spectrometer setting at 4 cm⁻¹ resolution. A 2 mm Gecrystal, with a 45° face angle maintaining constant contact pressurebetween crystal and the film specimens was used. All spectra werecorrected for spectral distortions and optical effects using Urban-Huangalgorithm (as described in M. W. Urban, Attenuated Total ReflectanceSpectroscopy of Polymers; Theory and Applications (American ChemicalSociety and Oxford University Press, Washington, D.C., 1996)). Chitosanpowders were analyzed by diffuse reflectance Fourier transfer infrared(DRIFT). In a typical experiment 100 scans were collected. Each spectrumof film represents 100 co-added scans ratioed to 100 reference scanscollected using an empty attenuated total reflectance (ATR) cell,whereas for DRIFT the number is 500.

Internal reflection infrared (IRIR) images (as described in D. Otts, P.Zhang, M. W. Urban, Langmuir 18, 6473 (2002)) were obtained using aBio-Rad FTS 7000 Stingray system equipped with internal reflection IRimaging (IRIRI) providing 1 micron spatial resolution. This systemconsists of a Bio-Rad FTS 7000 spectrometer, a Varian 600 UMAmicroscope, an image IR focal plane array (FPA) image detector, andinternal reflection IR imaging. The IR images were collected using thefollowing spectral acquisition parameters: under sampling ratio 2,rapid-scan speed 5 Hz, number of images per step 64, and spectralresolution 4 cm⁻¹. In a typical experiment, spectral data setacquisition time was 1 min and image processing was performed using ENVIsoftware (The Environment for Visualizing Images, Research Systems,Inc.) v. 3.5.

Solid-state ¹³C NMR measurements were performed on a Varian^(UNIT)YINOVA 400 spectrometer using a standard Chemagnetics 7.5 mmPENCIL-style probe. Samples were loaded into zirconia rotor sleeves,sealed with Teflon caps, and spun at a rate of 4.5 kHz, The standardcross-polarization magic angle spinning (CP/MAS) technique was used witha high-power proton decoupling implemented during data acquisition. Theacquisition parameters were as follows: ¹H 90° pulse widths was 4.0 μs,the cross-polarization contact time was 1 μs, the dead time delay of 3 sbetween scans was utilized.

Step 1: Formation of OXE-CHI Precursor

FIGS. 4, 5, and 6 illustrate ATR FT-IR, Raman, and solid state ¹³C NMRspectra of OXE-CHI product. FIG. 4, Traces A and B, illustrate ATR-FT-IRspectra of CHI and OXE-CHI, respectively. The bands at 1665 cm⁻¹ (—C═Oof —NH—CO—CH₃) decreases, whereas the band at 1580 cm⁻¹ (—NH₂, amide I)increases due to the conversion of acetalamide into amide groups (Step1). Comparison of the band intensities due to CHI (Trace A) and OXE-CHI(Trace B) shows the broadening of the 1070 cm⁻¹ band as a result of theoverlap of symmetric —C—O—C— stretching vibrations of OXE ring at 1040cm⁻¹ with the —C—O—C— modes of CHI. The symmetric —C—O—C— stretchingband at 985 cm⁻¹ also increases with respect to the 1070 cm⁻¹ band.

Confirmation of the OXE ring incorporation into the CHI backbone isillustrated in Raman spectra shown in FIG. 5. While Trace A illustratesthe reference spectrum of CHI, Trace B shows an increase of symmetric—CH2— stretching band of —OCH₂— of chitosan at 2885 cm⁻¹ due tosymmetric and asymmetric stretching of —CH₃ group of OXE. The presenceof the quaternary (CC₄) carbon in the OXE ring and breathing of thering, which is forbidden in IR, contributes to the enhanced intensity ofthe band shown in Trace B. The appearance of new bands at 1420 and 1256cm⁻¹ also shows —CH₂— scissoring and —CH₂ breathing modes of OXE ring,respectively.

Solid-state ¹³C NMR spectra are shown in FIG. 6. Trace A shows the ¹³CNMR spectrum of CHI and the characteristics resonances due to carbonylcarbon (a) of acetamide group in pyranose ring and carbon (b) attributedto the methyl of acetamide group at 175 and 22.5 ppm are detected,respectively. These resonances are not detected in Trace B due to theconversion of acetamide into primary amine groups and give rise to a newresonances at 23.7 and 40.5 ppm which correspond to carbon atom (d) ofthe dangling —CH₃ group and —CC₄ (e) of OXE ring. In Trace A, theresonance at 33.5 ppm corresponds to carbon (c) of the pyranose ringwhich shifts to 49.8 ppm (Trace B) due to OXE substitution, as shown inFIGS. 6 and 7).

Step 2: Formation of OXE-CHI-PUR Networks.

For reference purposes, FIG. 7 illustrates ¹³C NMR spectrum of PUR withcharacteristic CH₂ and C═O resonances. Upon incorporation of OXE-CHI inPUR characteristic resonances at 103 and 85 ppm due to the CHI ring andshift of the 13 ppm resonance due to methyl groups on the OXE ringsignify the formation of OXE-CHI-PUR networks, which is illustrated inFIG. 5. Furthermore, ATR FT-IR spectra illustrated in FIG. 9 illustratesthe disappearance of the —NH₂ bands at 1585 cm⁻¹ of the product anddetections of new bands at 1425 and 985 cm⁻¹ due to CH2 scissoring and—C—O—C— stretching vibration of OXE, respectively, thus confirming theformation of OXE-CHI-PUR networks.

Self-Repairing Mechanism

FIG. 10 illustrates ATR FT-IR spectra recorded before (Trace A) andafter the UV exposure (Trace B) of the damaged area of the OXE-CHI-PURnetwork. The NH— bending vibrations due to polyurea, which is a part ofthe PUR network at 1562 cm⁻¹ (Trace A), shift to 1542 cm⁻¹ (Trace B).The latter corresponds to the NH-bending vibrations of the urethanefunctionality (as described in D. B. Otts, M. W. Urban, Polymer 46, 2699(2005); W. H. Nosal, D. W. Thompson, L. Yan, S. Sarkar, A. Subramanian,J. A. Woollam, Colloids Surf B 43, 131 (2005); and K. Heung, M. W.Urban, Langmuir 16, 5382 (2000)). These observations indicate aconversion of polyurea to polyurethane linkages. The decrease of theband intensity of the band due to tertiary methyl groups at 1378 cm⁻¹and a subsequent increase of the band due to —CH₂ wagging vibrations at1348 cm⁻¹ along with the disappearance of —C—O—C— stretching of OXE at985 cm⁻¹ result from the loss of the OXE ring structure and formation oflinear alkyl groups within the network. In contrast, the increase of theband intensities at 1135 and 1068 cm⁻¹ due to the —C—O—C— stretchingvibrations and alkyl peroxide formation results from the scission of CHIlinkages and the OXE ring opening during UV exposure, as described in D.Lin-Vein, N. B. Colthup, W. G. Fateley, J. G. Grasselli, The Handbook ofInfrared and Raman Characteristics Frequencies of Organic Molecules(Academic Press, San Diego, Calif., 1991); G. Socrates, Infrared andRaman Characteristic Group Frequencies: Tables and Charts, 3^(rd) ed.(John Wiley and Sons Ltd., New York, 2001); A. Pawlak, M. Mucha,Thermochim. Acta 396, 153 (2003); and E. Pretsch, P. Buhlmann, C.Affolter, Structure Determination of Organic Compounds, 3rd ed.(Springer, Germany, 2000).

Internal reflection IR imaging was used, as described in D. Otts, P.Zhang, M. W. Urban, Langmuir 18, 6473 (2002), which allows users to tuneinto specific IR bands associated with a given species in a specificdamaged area. A spatial resolution is approximately 1 μm. Of particularinterest is to determine distribution of the OXE-CHI entities within thenetworks and to follow molecular events responsible for the networkrepair. Therefore, the 1542 and 1348 cm⁻¹ bands were tuned in due to N—Hbending of PUR and CH₂ wagging of ether linkages of the OXE ring as afunction the UV exposure time. Images A, B, and C in FIGS. 11 and 12represent distribution of these species in the specific areas labeledA′/A″, B′/B″, and C′/C″ as a function of time, whereas spectral changesrecorded from these areas in the 1600-1500 cm⁻¹, 1400-1250 cm⁻¹, and1175-975 cm⁻¹ are shown in A1, B1, and C1, and are labeled A′/A″, B′/B″,and C′/C″. These spectra represent band intensity changes of speciesparticipating in the repair process.

As shown in FIG. 11, A, B, and C represent three images recorded afterUV exposure of OXE-CHI-PUR specimens for 0, 15, and 30 min,respectively. These images were collected from the damaged area shown inFIG. 2 and FIG. 11, A, and exhibits heterogeneous distributions of the1542 cm⁻¹ band. The damaged area labeled A′ shows lower concentrationlevels of the N—H entities, whereas the area A″ away from the damagearea exhibits higher concentration of these species. The correspondingspectra shown in FIG. 11, A1 obtained from the areas A′ and A″ confirmthat the band intensities of the following vibrations change: decreaseof 1562 and 1378 cm⁻¹ bands of the urea linkages and —CH₂— wagging oflinear alkyls, respectively, increase of 1108 cm⁻¹ band of —C—O—C—stretching vibrations of linear aliphatic ethers and a decrease of the985 cm⁻¹ band due to —C—O—C— stretching of the OXE ring.

The images recorded from the specimens exposed to UV radiation for 15and 30 min are shown in FIG. 11, B and C, respectively. The distributionof chemical entities in areas B′ and C′ appear homogenous, indicatingthat the surface repair occurred. This is also reflected inspectroscopic changes illustrated in FIG. 11, B1-B3 and C1-C3. As thescratch is exposed to UV, the urea linkage represented by the band at1562 cm⁻¹ shifts to 1542 cm⁻¹ which is due to polyurea-polyurethaneconversion, whereas the opening of the OXE ring results in the decreaseof the band intensities at 1378 and 985 cm⁻¹. Increase of the bandintensities at 1348, 1135, 1108, and 1038 cm⁻¹ in the areas B′ and C′corresponds to the —C—O—C— bond formation within the network that isresponsible for self-repairing. Similar analysis shown in FIG. 12 wasperformed by tuning into the 1348 cm⁻¹ band due to —CH₂— waggingvibrations and showed similar intensity changes of the 1562, 1542, 1135,1108, 1038 and 985 cm⁻¹ bands.

Based on the spectroscopic data analyses, the mechanism of remending ofthe OXE-CHI-PUR networks is proposed as illustrated in FIG. 13. Thecrosslinked network is represented by red thick lines, whereas danglingOXE entities are black thinner lines. Molecular segments of OXE-CHI-PURnetwork responsible for self-healing are also depicted. As a mechanicaldamage is created, such as shown in FIG. 13, B, OXE rings open up. Uponexposure to UV light, crosslinking reactions of the OXE-CHI entitiesresult in self-healing of the damage area. This is illustrated in FIG.13, C. Chemical reactions leading to UV-induced repair are alsoillustrated in FIG. 13. The analysis of the internal reflection IRimaging data (FIGS. 11 and 12) show the decrease of the 1562 and 985cm⁻¹ bands due to urea and the —C—O—C— of oxetane, respectively, and theincrease of the 1542, 1135 and 1068 cm⁻¹ bands due to urethane, linear—C—O—C— entities, and alkyl peroxides, respectively. These changes allowfor the identification of three different products top, middle, andbottom shown in FIG. 13B. FIG. 13B top results from breaking of urealinkages as well as the ring opening of OXE, and formation of urethanelinkages, whereas FIG. 13B middle is the product of OXE ring opening andscission of the CHI linkages as a result of an easy cleavage under UVexposure, and the formation of alkyl peroxide linkages. FIG. 13B bottomis the product the urea breakage, CHI and OXE ring opening and formationof urethane and linear —C—O—C crosslinks.

Example 2

Tri-functional homopolymer of hexamethylene diisocyanate (HDI) (DesmodurXP 2410) was obtained from Bayer Material Science. 3-chloro-3-methyloxetane (OXE) and Tetrahydro-furfuryl chloride (OXO) were purchased fromTCI America. Chitosan (CHI) (degree of deacetylation 75-85%), methanol,polyethylene glycol (M,=300), sodium hydroxide beads, acetone,dibutyltin dilaurate (DBTL), dimethyl sulfoxide (DMSO), were purchasedfrom Sigma Aldrich Co.

OXO-substituted chitosan was synthesized by following the previouslydescribed procedure. Similarly OXE-OXO-CHI was prepared by reactingequimolar amount of pre-cooled 3-chloro-3-methyl oxetane (OXE) andtetrahydro-furfuryl chloride (OXO) with CHI in alkaline medium.

At first OXO-CHI product was dispersed in DMSO by sonicating at 25° C.for 12 hrs followed by continuous stirring at 80° C. for 48 hrs. Thentrifunctional HDI was mixed with dispersed OXE-CHI and PEG usingoverhead agitation at 500 rpm with a small four-bladepolytetrafluoroethylene (PTFE) impeller in a 50 ml three-neck reactionflask at 25° C. for 10 min under nitrogen atmosphere. A series ofpolyurethane network were made and the relative molar equivalent ratiosof isocyanate, PEG and OXO-CHI were varied from 1:1.5:0 to1:1.33:1.17×10⁻⁴, while maintaining 38% (w/w) solids in each case.Following the mixing process, such mixture was applied to obtain approx.300 μm (1 4 pm) thick films on a PTFE substrate at 30° C. under 15%relative humidity (RH) for 12 hrs in a vacuum oven followed by 80° C.for 48 hrs. The films were mechanically damaged with a razor blade toobtain a desired width and depth of the mechanical damage. UV exposuresof the films were conducted using a 120 W UV lamp of 302 nm wavelengthof light.

Attenuated total reflectance Fourier transform infrared (μATR FT-IR)spectrum were obtained using a Bio-Rad FTS-6000 FTIR single-beamspectrometer setting at 4 cm⁻¹ resolution. A 2 mm Ge crystal, with a 45°face angle maintaining constant contact pressure between crystal and thefilm specimens was used. All IR spectra were corrected for spectraldistortions and optical effects using Urban-Huang algorithm. OXO-CHI,OXE-OXO-CHI powders were analyzed by diffuse reflectance Fouriertransfer infrared (DRIFT). In a typical experiment 100 scans werecollected. Each spectrum of film represents 100 co-added scans ratioedto 100 reference scans collected using an empty attenuated totalreflectance (ATR) cell, whereas for DRIFT the number is 500.

FIG. 14 illustrates chemical reactions that lead to the formation of PURnetworks containing four (OXE-CHI-PUR), five (OXO-CHI-PUR) member rings,and their combination OXE/OXO-CHI-PUR). The same synthetic protocol wasfollowed as discussed above in Example 1. To verify the formation ofOXE-CHI, OXO-CHI, and OXE/OXO-CHI, ATR FT-IR spectra were recorded (notshown herein) Traces, A, B, and C are the spectrum of OXE-CHI, OXO-CHI,and OXE/OXO-CHI-PUR, respectively. For reference, Trace D is the spectraof CHI. As seen in Traces A, B, and C an increase of the intensity ofthe 1590 cm⁻¹ band due to amino groups (amide I) and a decrease ofacetamide band (—C═O of —NH—CO—CH₃) at 1665 cm⁻¹ result from theconversion of acetamide to amide groups. The appearance of new band at985 cm⁻¹ due to symmetric —C—O—C— stretching of OXE (Trace A) indicatesthe incorporation of OXE within CHI backbone. Trace B illustrates the IRspectrum of OXO-CHI, where the characteristic —C—O—C— stretching band at1085 cm⁻¹ of OXO overlaps with the —C—O—C— stretching band of CHI (TraceD) resulting in increase and the shift of the —C—O—C— band (Trace B).Furthermore, enhanced intensity of the band at 1326 cm⁻¹ due to —CH₂—deformation modes of OXO is observed in Trace B. On the other hand,Trace C, which illustrates IR spectrum of OXE/OXO-CHI, shows theappearance of new band at 985 cm⁻¹ attributed to symmetric —C—O—C—stretching vibrations of OXE ring. Again, the incorporation of OXE inOXE-OXO-CHI is manifested by increase and shift of the 1378 cm⁻¹ bandattributed to quaternary (CC₄) carbon of OXE (Traces A and C). Thesecond step shown in FIG. 1 illustrates reactions leading to theformation of OXE-CHI-PUR, OXO-CHI-PUR, and OXE-OXO-CHI-PUR by theincorporation of HDI in the presence of PEG. As evident in the IRspectra (not shown herein) of Traces A, B and C, the 1562 cm⁻¹ band isdue to urea linkages, indicating the reaction of substituted chitosanswith trifunctional HDI (circled in FIG. 1). Comparison of the bandintensities in Traces A, B, and C shows the increase of the 1105 cm⁻¹band due to —C—O—C— stretching vibrations of CHI, while the new 990 cm⁻¹band attributed to symmetric C—O—C— stretching vibrations of OXE isdetected in Traces A and C. Furthermore, enhanced intensity of the bandat 1326 cm⁻¹ due to —CH₂-deformation modes of OXO is observed in TracesB and C. In Traces A and C the enhanced intensity of bands at 1378 and1348 cm⁻¹ due to —CC₄ of OXE and —CH2- wagging manifest the presence ofOXE within the OXE-CHI-PUR and OXE-OXO-CHI-PUR networks, whereas theappearance of 1045 cm⁻¹ due to —C—O—C— stretching of OXE in Traces B andC confirms the presence of OXO within OXO-CHI-PUR and OXE-OXO-CHI-PURnetworks.

When mechanical damage was induced in OXO-CHI-PUR (Panel A) andOXE-OXO-CHI-PUR (Panel B) films, upon exposure to UV light damagesdisappeared. The sequence of events recorded every 15 min from the timedamage was made is shown in FIG. 15, (A1-A4) and (B1-B4). As we recallthe repair time for OXE-CHI-PUR for the same stoichiometry the repairtime is approximately 30 min. Comparison of these data indicates thatthe presence of OXO compounds slow down the self-healing ability of thenetwork.

While the invention has been shown or described in only some of itsforms, it should be apparent to those skilled in the art that it is notso limited, but is susceptible to various changes without departing fromthe scope of the invention.

What is claimed is:
 1. A cyclic oxide-substituted biodegradable naturalpolysaccharide polyurethane composition comprising a reaction productof: a) a polyol or a thiol; b) an isocyanate; and c) a compositioncomprising:[BNP-OXE₁₋₂]_(n) wherein BNP is a disaccharide of a biodegradablenatural polysaccharide selected from the group consisting of chitosan,pectin, heparin, and combinations thereof, OXE is an oxetane, oxolane,or oxepane compound, and n ranges from 5 to about
 1475. 2. Thecomposition of claim 1, wherein the isocyanate comprisesmethylenediisocyanate (MDI); hexamethylenediisocyanate (HDI);isophorenediisocyanate (IPDI); toluenediisocyanate (TDI); 2,4-toluenediisocyanate; 2,6-toluene diisocyanate; 2,2′-methylenediphenylenediisocyanate; 2,4′-methylenediphenylene diisocyanate;4,4′-methylenediphenylene diisocyanate; polyphenylene polymethylenepolyisocyanate; saturated 2,4-methylcyclohexane diisocyanate, saturated2,6-methylcyclohexane diisocyanate; 2,2′-methylene dicyclohexylenediisocyanate; 2,4′-methylene dicyclohexylene diisocyanate;4,4′-methylene dicyclohexylene diisocyanate; isophorone diisocyanate;1,4-diisocyanatobutane; 1,5-diisocyanatopentane; 1,6-diisocyanatohexane;1,4-cyclohexane diisocyanate; isomeric mixtures thereof; or combinationsthereof.
 3. The composition of claim 1, wherein the polyol comprisesethylene glycol, diethylene glycol, triethylene glycol, tetraethyleneglycol, polyethylene glycol, propylene glycol, dipropylene glycol,polypropylene glycol, 1,4-butanediol, 1,6-hexanediol, polytetramethyleneglycol, polyesterdiol, derivatives thereof, or combinations thereof. 4.The composition of claim 1, wherein the thiol comprises polythiol,pentaerythritol tetrakis(3-mercaptoproprionate) (PET3MP), trifunctionalthiols, tetrafunctional thiols, thiol esters, thiol acrylates, orcombinations thereof.
 5. A cyclic oxide-substituted chitosan compositioncomprising:[CHI-OXE₁₋₂]_(n) wherein CHI is a disaccharide of chitosan, OXE is anoxolane compound, and n ranges from 5 to about
 1475. 6. A cyclicoxide-substituted chitosan polyurethane composition comprising areaction product of a) a polyol or a thiol; b) an isocyanate; and c) acomposition comprising:[CHI-OXE₁₋₂]_(n) wherein CHI is a disaccharide of chitosan, OXE is anoxetane, oxolane or oxepane compound, and n ranges from 5 to about 1475.7. The composition of claim 6 formed into a coating or a film.
 8. Thecyclic oxide-substituted chitosan polyurethane composition of claim 6comprising:

wherein HDI is an isocyanate, CHI is a disaccharide of chitosan, OXE isan oxetane, oxolane or oxepane compound, m ranges from 3-450, p rangesfrom 0-540, and n ranges from 5 to about
 1475. 9. The composition ofclaim 8, wherein the isocyanate comprises methylenediisocyanate (MDI);hexamethylenediisocyanate (HDI); isophorenediisocyanate (IPDI);toluenediisocyanate (TDI); 2,4-toluene diisocyanate; 2,6-toluenediisocyanate; 2,2′-methylenediphenylene diisocyanate;2,4′-methylenediphenylene diisocyanate; 4,4′-methylenediphenylenediisocyanate; polyphenylene polymethylene polyisocyanate; saturated2,4-methylcyclohexane diisocyanate, saturated 2,6-methylcyclohexanediisocyanate; 2,2′-methylene dicyclohexylene diisocyanate;2,4′-methylene dicyclohexylene diisocyanate; 4,4′-methylenedicyclohexylene diisocyanate; isophorone diisocyanate;1,4-diisocyanatobutane; 1,5-diisocyanatopentane; 1,6-diisocyanatohexane;1,4-cyclohexane diisocyanate; isomeric mixtures thereof; or combinationsthereof.
 10. The composition of claim 8, wherein the polyol comprisesethylene glycol, diethylene glycol, triethylene glycol, tetraethyleneglycol, polyethylene glycol, propylene glycol, dipropylene glycol,polypropylene glycol, 1,4-butanediol, 1,6-hexanediol, polytetramethyleneglycol, polyesterdiol, derivatives thereof, or combinations thereof. 11.The composition of claim 8, wherein the thiol comprises polythiol,pentaerythritol tetrakis(3-mercaptoproprionate) (PET3MP), trifunctionalthiols, tetrafunctional thiols, thiol esters, thiol acrylates, orcombinations thereof.
 12. The composition of claim 8, wherein thechitosan has a degree of deacetylation ranging from about 75% to about85%.
 13. The composition of claim 8, further comprising an alkalinesolvent.
 14. The composition of claim 8, wherein OXE is an oxetanecompound.
 15. The composition of claim 8, wherein OXE is an oxolanecompound.
 16. A method of prophylactically repairing mechanical damageto a substrate comprising the steps of applying the composition of claim6 to a substrate, wherein upon exposure of the substrate to a UV source,the composition initiates self-repair of the mechanical damage to thesubstrate.
 17. The method of claim 16, wherein the substrate comprisesmetal, plastic, glass, or combinations thereof.